Uncompromising Memory Solutions
With Memory accounting for more than 50% of total chip power and over 70% of the chip area in today’s SoCs, traditional memory can’t keep up with the increasing demand for data hungry operations. Xenergic tackles this by delivering low power memory IP – efficiently saving power- and area costs.
Our Solutions

High-Speed Low-Power SRAM
Reducing SoC Power By 70%-90%
Xenergic address the power needs of the IC design community by delivering cutting-edge, low-power SRAM that can be tailored according to the customers’ memory specifications. Xenergic’s novel memory architecture offers optimized power consumption and performance with a competitive area in nominal or scaled supply voltage for any given application.



Ultra High-Speed SRAM
Pushing The Boundaries of High-Speed
Xenergic’s Ultra-High-Speed SRAM solutions are ground-breaking in terms of performance, reaching frequencies 30% higher than competing SRAM.

High-Speed Turbo Memory
A Paradigm Shift in Processing
Our High-Speed Turbo Memories are our newest offering, revolutionising high-performance-computation. In short, they double the speed of the fastest conventional SRAM, take up 60% less area, and consume a fraction of the power. Truly a memory in a class of its own.

Flexible Plug-and-Play Integration
Xenergic’s utilisation of single rail memories, coupled with Xenergic’s cutting-edge tailoring techniques, enables a solution optimised for static- and dynamic power, performance and area. Our methodology enables us to push the boundaries beyond the current market standard in terms of power efficiency.
Xenergic’s memories use foundry provided bitcells and no additional metal layers. With memory interface DFT views incorporated in all our products, integration in existing design flows on the customer side becomes a breeze. Support of all standard optional memory features such as redundancy, ECC, external tuning, periphery gating, sleep modes, periphery body biasing, etc, ensures our ability to meet every customer’s needs – No matter the applications.